The rapid temperature change test chamber is a cycling chamber designed to facilitate the observation of thermal shock tests.
Due to the increasing number of issues that affect the reliability of electronic devices, printed circuit boards and their reliability, there is a need for a more suitable method to evaluate them. The rapid temperature change test chamber states that the rate of change in temperature of the test sample should be less than 15 degrees Celsius per minute. This is the main difference between the heat shock test and this method. The rapid temperature change test produces repeatable results and determines compliance with standards such as JEDEC (JESD 22A104B span>).
Features:
For quality control:
The company has created a new rapid change room to facilitate product testing for industrial workers. This room is used for quality control and product testing. This facility is used to test the reliability and performance of semiconductor chips, optical communication modules and other test systems.
Two 1.5 kW Tecumseh French compressors are used in the rapid temperature change test room. The cooling power change rate is 3℃/min. The machine can perform online product monitoring according to the temperature change rate. Automatic volume and air speed adjustments are made. This ensures that the temperature in the test area is distributed properly. An electronic expansion valve minimizes surface differences and allows precise control.
Fast heat exchanger housing is a popular choice for 5G optical modules or fiber optic communication components. Almost all optical devices must pass through high and low temperatures before leaving the factory. Each material has a different rate of thermal expansion. Only a change in temperature can test the risk of material failure.
Thermal cycle test to determine the rate of heating and cooling at least once per minute. The device must remain at least 10 minutes to reach room temperature. For interior light modules, it is acceptable to cycle 100 times. The external heat module requires 500 thermal cycles. The product is also more stressed by rapid changes in temperature. This improves the efficiency of stress analysis. If the load is more than 100kg, linear 15 ℃ / min in the heating and cooling load, the temperature deviation in the test room is + -2.0
This room is used for testing the mechanical properties of electronic products, their flexibility and stress testing under the specified temperature conditions of rapid change or slow temperature change. You can test and evaluate the physical and other characteristics of the product. The door can be opened or closed without any effort. You can add or remove tested samples from the workspace.
The rapid temperature change test room has a large and spacious viewing window:
Cover Design:
Heating system: